Suitable for high-end machine motherboards/electronic components/BGA chips/SMT maintenance, etc.
Product Size: 32x32x38.4mm
Melting Point: 138℃
– Good wettability, strong viscosity
– Preferred raw materials, lead-free and environmentally friendly
– Accurate temperature, effective protection of circuit board components
– Low temperature tin planting
– 138℃ low melting point, accurate temperature, effective protection of circuit board components.
RELIFE RL-404 138℃ Low Temperature Solder Paste