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MiJing High Precision BGA Reballing Stencil for iPad 6 / mini 4


SKU: TR_MJ-IPH-9 Category:
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– MJ high-quality BGA Reballing Stencil, 100% new brand and high quality.
– Ultra-thin steel template, just 0.12mm thickness, easy to use.
– Laser engraving, Grooves staircase.
– German Craftsmanship, Quick hand, Pinpoint.
– Support for: Support for: iPad 6 / mini 4
– Please Planting tin net again the chip foot, the temperature of the hot air gun is controlled within 250 degrees.
– The too high temperature is going to make the product deformed, secure with tweezers planting tin net.
– Apply the solder paste evenly, make sure than each hole is covered with solder paste, clean the surface of the steel net with a clean cloth.
– Then blow and weld the ball with a hot air gun, after cooling slightly the steel net tube is separated from the chip.

Weight 0.4 kg
Dimensions 8 × 8 × 5 cm


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MiJing High Precision BGA Reballing Stencil for iPad 6 / mini 4

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